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How to Troubleshoot When the Soldering Iron Doesn't Tin

Nov 21,2024
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Author: Shenzhen YuFan Microelectronics Co., Ltd.

How to Troubleshoot When the Soldering Iron Doesn't Tin

When you encounter the issue of the soldering iron not tinning, there could be several underlying causes. Here are some common reasons and their respective solutions:

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Insufficient Temperature:

If the temperature of the soldering iron is not high enough to melt the solder, it won't tin properly. To address this, adjust the temperature setting of the soldering iron to ensure it reaches a sufficient heat level for melting the solder. Refer to the temperature guidelines and adjust the soldering iron accordingly.

Oxidation or Contamination:

Oxidation or contamination on the soldering iron's tip or the solder paste can hinder proper tinning. To resolve this, clean the soldering iron tip and the solder paste area. Use a soldering tip cleaner or alcohol-soaked cotton swabs to wipe the tip, ensuring it is free from any debris. If the solder paste is contaminated, gently clean its surface with a clean cloth.

Poor Quality Solder Paste:

Using low-quality or expired solder paste may result in inadequate tinning. Check the expiration date of the solder paste and replace it if it has expired.

Damaged Soldering Iron Tip:

A damaged or excessively worn soldering iron tip can affect tinning performance. Replace the soldering iron tip with a new one to ensure optimal results. Regularly inspecting and maintaining the soldering iron tip will prolong its lifespan and improve tinning performance.

Incomplete Melting of Solder Paste:

Insufficient melting of the solder paste can lead to poor tinning. Confirm that the soldering iron tip and the soldering area reach a suitable temperature for complete melting. Adjust the soldering time or temperature settings as needed to achieve thorough melting of the solder paste.

Improper Application of Solder Paste:

Ensure that the solder paste is evenly applied to the soldering area before tinning. This will guarantee proper adhesion and coverage of the solder joints.

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