Microcontroller is essentially a chip, there are many types of packaging, For example, DIP(Dual In-line Package), SOP(Small out-of-line Package), PLCC(Plastic Leaded Chip Carrier plastic chip package with lead), QFP(Quad) Flat Package plastic square flat package), PGA(Pin Grid Array package Pin Grid Array package), BGA(Ball Grid Array Package), etc. The following is a brief introduction to common chip packaging forms.

1. DIP encapsulation

DIP(Dual in-line Package) refers to integrated circuit chips that are packaged In the form of dual in-line. Most small and medium-sized integrated circuits (ics) are packaged in this form, and the number of pins is generally not more than 100. Special care should be taken when plugging DIP-packaged chips from the chip socket to avoid damaging the pins.

DIP package chip diagram:

The DIP package has the following features:

(1) Suitable for perforation and welding on PCB (printed circuit board), easy to operate.

(2) The ratio between the chip area and the package area is large, so the volume is also large.

2. The SOP encapsulation

SOP(Small out-of-line Package) is a very common form of components. One of the surface-mount packages, with the pins leading from the sides of the package in the shape of a seagull wing (L). The materials are plastic and ceramic.

SOP package chip diagram:

3. The PLCC encapsulation

PLCC(Plastic Leaded Chip Carrier Plastic chip package with lead) is one of the surface mount packages. It has a square shape and 32 pins. The pins lead out from the four sides of the package and are shaped like a T-shaped plastic product. PLCC package is suitable for installing and wiring PCB with SMT surface mounting technology, which has the advantages of small size and high reliability.

PLCC package chip diagram:

4. QFP encapsulation

Quad Flat Package (QFP) chip pins have very small distance between each other and very thin pins. Generally, large-scale or ultra-large integrated circuits adopt this packaging form, and the number of pins is usually more than 100. Chips packaged in this form must be soldered to the motherboard using SMD(Surface Mounted Device Technology). Smd-mounted chips do not need to be drilled on the motherboard, and there are usually solder joints designed for corresponding pins on the motherboard surface. By aligning each foot of the chip with the corresponding solder joint, the mainboard can be welded. Chips welded in this way are difficult to disassemble without special tools. The QFP package chip is shown in Figure 4.

Chips packaged in the Plastic Flat Package (PFP) mode are basically the same as those packaged in the QFP mode. The only difference is that QFP is generally square, whereas PFP can be either square or rectangle.

The QFP/PFP package has the following features:

(1) Suitable for SMD surface mounting technology on P CB circuit board installation wiring.

(2) Suitable for high frequency use.

(3) Easy to operate and high reliability.

(4) The ratio between chip area and package area is small.

QFP package chip diagram:

5. PGA encapsulation

PGA(Pin Grid Array package Pin Grid Array packaging) chip packaging mode has multiple square shaped pins inside and outside the chip, and each square shaped pin is arranged at a certain distance around the chip. Depending on the number of pins, it can be enclosed in 2-5 circles. When installing, plug the chip into a specialized PGA socket. The PGA package has the following features:

(1) More convenient insertion and removal operation, high reliability.

(2) can adapt to higher frequency.

PGA package chip diagram:

6.BGA ball grid array package

With the development of integrated circuit technology, the requirements of integrated circuit packaging are more stringent. This is because the packaging technology is related to the functionality of the product. When the frequency of IC exceeds 100MHz, the traditional packaging method may produce the so-called "Cross Talk" phenomenon, and when the number of pins of IC is greater than 208 Pin, the traditional packaging method has its difficulties. Therefore, in addition to the use of QFP packaging, most of the current high pin chips are converted to use BGA(Ball Grid Array Package) packaging technology. As soon as BGA appeared, it became the best choice for high density, high performance and multi-pin packaging such as CPU and South/North bridge chip on motherboard.

The BGA package has the following features:

(1) Although the number of I/O pins increases, the distance between pins is much greater than that of QFP packaging, which improves the yield.

(2) Although the power consumption of BGA increases, the electric heating performance can be improved due to the controlled collapse chip welding method.

(3) The signal transmission delay is small, and the adaptation frequency is greatly improved.

(4) The assembly can be coplanar welding, the reliability is greatly improved.

The BGA package chip is shown in Figure 6:

The above is about the MCU all kinds of packaging content sharing, of course, more than the above several types of packaging. Yufan micro provides ic wafer production and packaging customization, as a nine level agent, has more than 10 years of SCM chip application design experience, for the majority of electronic products manufacturers to provide MCU application function customization development services.