logo logologo

Language
Search...

Products

Products

Home > Products > JL Bluetooth Chips > Audio Bluetooth Chip

Audio Bluetooth Chip JL7012F

32bit Dual-Core DSP

Product Features

  • CPU

    32bit Dual-Core DSP

    Maximum speed 160MHz

    32KB ICache and 16KB DCache

    IEEE754 Single precision FPU

    Mathematical accelerate engine

    Interrupts with 8 priority level

  • Memory

    On-chip 640KB SRAM

    Support MMU

    Built-In Flash

  • Clocks

    On-chip 16 MHz clock oscillator

    On-chip 200 kHz lower-temperature-drift  clock oscillator

    24 MHz crystal oscillator

    32.768 kHz crystal oscillator

  • DSP Audio Processing

    SBC/mSBC encoder and decoder

    Support MP2, MP3, WMA, APE, FLAC,  AAC, MP4, M4A, WAV, AIF, AIFC audio  decoding

    Packet Loss Concealment (PLC) for voice  processing

    Single/Dual MIC Environmental Noise  Cancellation (ENC)

    Multi-band DRC limiter

    Multi-band EQ configuration for voice  Effects

  • Audio Codec

    Two channels 24-bit DAC,SNR ≥ 98dB

    Four channels 24-bit ADC,SNR ≥ 95dB

    Audio DAC Sampling rates of  8kHz/11.025kHz/16kHz/22.05kHz/24kHz/  32kHz/44.1kHz/48kHz/64kHz/88.2kHz/  96kHz are supported

    Audio ADC Sampling rates of 8kHz/11.025kHz/16kHz/22.05kHz/24kHz/32 kHz/44.1kHz/48kHz are supported  

    Support four digital/analog MIC inputs  

    Four channels analog audio inputs

    Audio DAC support differential cap-less  mode or single-ended mode

    Direct drive 16ohm/32ohm Speaker loading

  • Bluetooth

    Compliant with Bluetooth  V5.3+BR+EDR+BLE specification

    Support AoA/AoD direction finding

    Support LE audio BIS/CIS full function

    Meet class2 and class3 transmitting power  requirement

    Maximum +9dbm transmitting power

    EDR receiver with minimum -95dBm  sensitivity

    Support a2dp/avctp/avdtp/avrcp/hfp/spp/smp/  att/gap/gatt/rfcomm/sdp/l2cap profile

    bap 1.0/pacs 1.0/ccp 1.0/mcp 1.0/micp  1.0/vcp 1.0/csip 1.0

    a2dp 1.3.2/avctp 1.4/avdtp 1.3/ avrcp  1.6.2/hfp 1.8 /spp 1.2/rfcomm 1.1/pnp 1.3/hid  1.1.1/sdp core5.3/l2cap core 5.3

  • Graphics

    2D Graphics accelerator

    Support crop, scale, rotation process

    Support multiple data format graphics

    SPI and QSPI display driver

  • Peripherals

    One full speed USB OTG controller

    One SD host controller for eMMC/SD

    Six multi-function 32-bit timers, support  capture and PWM mode

    Four UART interface,  UART0,UART1&UART2 support DMA

    Two I2C Master/Slave interface

    Four SPI Master/Slave interface

    I2S Master/Slave interface

    QDEC

    Low power CapSense

    13-channel 10-bit ADC for analog sampling

    4-channel Motor PWM controller

    40 Individually programmable and  multiplexed GPIO pins

    Up to 12 external interrupt/wake-up  source(low power available,can be  multiplexed to any I/O)

  • PMU

    Built-in lithium battery charging manager,up  to 200mA charging current

    Built-in LDO and Buck DC-DC converter

    Less than 2uA sleep current

    VPWR range : 4.5V to 5.5V

    VBAT range : 2.2V to 4.5V

    IOVDD range : 2.2V to 3.6V

  • Packages

    QFN52(6mm*6mm)

  • Temperature

    Operating temperature: -40℃ to +85℃

    Storage temperature: -65℃ to +150℃

  • Application

    Bluetooth Smart Watch

    Bluetooth Smart Home

    Bluetooth Intelligent Voice

    Bluetooth Stereo speaker

    Bluetooth Soundbars

    Bluetooth TWS speaker

    Bluetooth alarm clock speaker

    Bluetooth Rod speaker

Block Diagram

BLE Bluetooth Chip AC6321A


Pin Assignment

BLE Bluetooth Chip AC6321A

How to Order

You can get your Audio Bluetooth Chip JL7012F solution by flling out the form below and we will contact you immediately.

Want to turn your idea into reality? Contact YFM Support
Copyright © 2022 Shenzhen Yufan Microelectronics Co., Ltd. All Rights Reserved. | Sitemap

Contact

Copyright © 2022 Shenzhen Yufan Microelectronics Co., Ltd. All Rights Reserved. | { fanyi('Sitemap') }}
Online

Email

Message
TOP